Adhesives for Electronics

Paladin offers epoxy curing agents, as well as reactive and non-reactive epoxy diluents suitable for use in electronic potting and encapsulation.

Paladin’s phenalkamine and phenalkamide products when incorporated in two-component epoxy systems provide an exceptional balance of cure and handling properties for electronic assembly processes. Our reactive and non-reactive epoxy diluents are developed on cardanol technology with low chlorine content. The unique chemical structure of cardanol provides excellent water resistance along with good flexibility to ensure optimum protection and functioning of electronic components.

Moreover, our products provide superior thermal shock, mechanical and chemical resistance along with excellent adhesion to various metals. Their durability and reliability extend the lifecycle of electronic components, allowing for longer lifespans of devices.