Our distilled CNSL-based epoxy curing agents, modifiers, and diluents are the ideal choice for building strong and durable bonds to challenging substrates such as water or oil contaminated substrates. Cardanol technology provides hydrophobicity along with fast cure, which allows adhesives to rapidly develop strong bonds to wet metal, damp concrete, or low surface energy substrates without the need for time consuming and costly substrate preparation.
Moreover, Paladin’s phenalkamine and phenalkamide epoxy curing agents develop high bond strength and cure even below 0°C, while providing good working time for applicators. Employing our products, forced-cure industrial applications can achieve increased line speeds and energy savings by processing at lower cure temperatures without affecting other performance properties.